产品参数
CPU
Intel® Comet lake 10th-Gen Celeron/Pentium/Core™ i9/i7/i5/i3 CPU,Intel® Q470 PCH
system memory
2 * DDR4 SO-DIMM slot, supporting up to 2933MHz and up to 64GB
Extension interface
1 * Mini PCIe Full size, PCIe X1 and SATA3 signal automatic switching, USB2.0+SIM, supporting mSATA or 4G LTE
1 * M.2 Type 2230 E-key, PCIeX1, USB2.0 and CNVio, supporting Gig+WiFi6 and BT5.0
1 * M.2 Type 3052 B-key, PCIeX1, USB2.0+SIM, supporting 5G NR model, compatible with 4G LTE
1 * M.2 Type 2280 M-Key (PCIex4 signal), supporting NVME high-speed storage disks or PCIe signal expansion modules
1 * MXM3.1, PCIeX16, up to 190W power supply, supporting all MXM GPU modules and AI acceleration cards with power consumption below 190W on the market
JHTECH-02 E/IO high-speed interface specification, 2 PCIeX4 signals, 2 * USB3.0, 2 * USB2.0160pin seismic high-speed signal European standard interface
Graphics
Intel® UHD Graphics, supports DirectX 12, openGL 4.5, core display 2 * HDMI 1.4, dual 4K ultra high definition display, highest resolution 4096x2304@24Hz
1 * MXM3.1 GPU module, supporting NVIDIA Gforce GTX full series and AMD RX series up to 190W power consumption GPU, 2 * DP 1.2 4K display
audio frequency
Realtek ALC chip, 1 * Audio out and 1 * MIC high fidelity audio, phone jack 3.5mm interface, supporting 5.1 channels
Ethernet
2 * Intel I225V+1 * I225 LM, 3 * 2.5G-LAN, supporting iAMT 13.0 active management, configuring Core I5/I7 CPU to support vPro technology
4*Intel I210AT PCIe Gig. Ethernet with POE function, 10/100/1000Mbps adaptive, single port independent PCIe 3.0X1 channel full bandwidth
storage
2*2.5" HDD SATA3 (supporting RAID0,1), capable of supporting up to high capacity dual 15mm thick HDDs, and up to 6G bit/second transmission speed
1 * M.2 Type 2280 M-Key (PCIex4 signal), supporting NVMe
Optional 1 * mSATA
DIO
8+16 bit TTL signal programmable input and output
I/O interface
3 * 2.5G-LAN, 4 * Gig-LAN (optional), (Rj45, front panel)
4 * USB3.2 (Type A), supporting up to 10G bit/second transmission speed, 2 * USB3.0 (optional) (front panel), 2 * USB2.0 (Type A) (rear panel)
1 * USB2.0 DuPont pin, 1 * USB2.0 Type A built-in, 1 * SIM card slot
2 * RS232/422/485, can be set through BIOS mode (DB9, rear panel), 2 * RS232 (2 * 5 DuPont pin, built-in)
1 * 8-bit DIO (2 * 5Pin Phoenix Terminal, Rear Panel), 1 * 16-bit DIO (2 * 10pin Phoenix Terminal, Optional, Front Panel)
CPU core display: 2 * HDMI, 1 * VGA (optional) (front panel), GPU independent display: 2 * DP (rear panel)
1 * Line out+1 * Mic 3.5mm phone jack (rear panel)
I-port interface
1 * I-port interface, supporting 16 bit DIO, 1 * CAN Bus module, 1 * USB2.0, 1 * VGA, 2 * COM, M.2 and other expansion function module interfaces
indicator light
1 * Hard disk indicator light, 3 * CPU temperature level indicator light (Red for alarm, Yellow for high temperature, Green for room temperature)
Control switch
1 * Power key w/LED, 2-pin Phoenix terminal remote switch, 1 * F-panel DuPont contact pin, AT-ATX Dip switch, Clear Cmos Dip switch
Power requirements
DC 9-36V, 3-pin 7.62 pitch Phoenix terminal block, wide voltage DC, overvoltage and overcurrent reverse protection, maximum output power 350W; Power consumption: TBD
Watchdog timer
Programmable timeout interrupt or system reset, 1 to 255 seconds
operating system
Windows 10 IoT Enterprise (64-bit),Windows Server 2019,Ubuntu,SUSE,Redhat Enterprise,
Wind River Linux,Yocto Project(64-bit),Wind River VxWorks 7
structure
Aluminum rectangular profile heat dissipation shell, SGCC box
colour
Black+Granite Grey
Installation method
Desktop installation
size
(W*H*D):284*222*82*mm
Net weight
TBD
working temperature
-20 ℃~60 ℃ with air flow
Storage temperature
-40° C~85° C
Storage humidity
10~90%@40° C. No condensation
Vibration
5grms/5~500Hz/random/working state (SSD); 1 grms/5~500Hz/random/working state (HDD)
to attack
50g peak acceleration (lasting for 11ms) (SSD); 20g peak acceleration (lasting for 11ms) (HDD)
EMC/Certification
CE/FCC Class B